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Send Gerbers, a stack-up or even a sketch. The scope of the build is confirmed in writing before anything is priced.
PCB capability and process ranges
Indicative ranges for seven product families — rigid and flex boards, rigid-flex combinations, laser-microvia HDI, metal-core and heavy-copper power boards, and tested assemblies. Every figure published here is checked against your drawing before a panel is cut.
Seven product families
Chongshuo Electronics Technology Co., Limited (深圳市重硕电子科技有限公司) manufactures bare boards and finished assemblies in Shenzhen, China. A structure is chosen against the mechanical, thermal and electrical requirements of the product rather than against a catalogue, and the stack-up, copper weight, surface finish and hole sizes are fixed in writing before the first panel is cut. The ranges below are typical working values, not guarantees.
Indicative process parameters
Every range, dimension and tolerance published on this page is indicative and typical, and is not a guarantee. Each figure is confirmed against your drawing, stack-up and manufacturing data package during DFM review and quotation, and the achievable value may vary with laminate type, board thickness, copper weight, surface finish and feature density. The values confirmed in writing in your quotation and order acknowledgement are the ones that govern production.
Capability at a glance
Each family, the construction behind it, and the typical layer range we work to. The parameters that sit behind these figures are set out in the sections below.
| Product | Structure | Typical Layer Range | Typical Application |
|---|---|---|---|
| Rigid PCB | Rigid FR-4, single, double or multilayer stack | 1–32 layers | Control equipment, power supplies, industrial and consumer electronics |
| Flexible PCB | Polyimide flex, static or dynamic | 1–8 layers | Camera modules, wearables, sensors, thin internal harnesses |
| Rigid-Flex PCB | Rigid and flex zones in one board | 2–16 layers (rigid and flex combined) | Wearables, camera modules, battery packs, robotics joints |
| HDI PCB | Sequential lamination with laser microvias | 4–20 layers | Fine-pitch BGA, mobile devices, miniaturised IoT products |
| Metal-Core PCB | Aluminium or copper base core | 1–4 layers | LED lighting and drivers, power modules, inverters |
| Heavy Copper PCB | Plated heavy copper, low layer count | 1–8 layers | EV charging, inverters, power conversion, industrial drives |
| PCB Assembly | SMT and through-hole, built and tested | SMT + THT (board layers per drawing) | Finished assemblies, box builds, functional-tested units |
Rigid PCB
Rigid boards account for most of the work on the floor. A single-sided control panel and a 32-layer backplane are built in the same family, but they are not the same job — the stack-up, the impedance rules and the copper balance are engineered separately for each. Laminates run from FR-4 through high-Tg and halogen-free grades, and the surface finish is picked from the soldering process rather than from habit. Copper weight, board thickness and hole sizes are settled in writing before the first panel is cut, so the board you approve is the board that ships.
Layer count
1–32 layers
Laminate
FR-4, high-Tg (≥170 °C) and halogen-free grades
Copper weight
1–6 oz typical; 0.5 oz inner layers on high-count builds
Min. trace / space
3/3 mil (0.075 mm) on advanced builds, 5/5 mil standard
Min. mechanical drill
0.20 mm typical, 0.15 mm on request
Board thickness
0.6–3.2 mm typical, built to the drawing
Impedance control
±10% typical on 50 Ω / 100 Ω lines, coupon-tested where specified
Surface finish
HASL lead-free, ENIG, immersion gold, OSP, immersion tin, matte black
Applications
Control equipment, power supplies, LED drivers, industrial electronics
Flexible PCB
A flexible circuit is a different mechanical discipline, not a thinner rigid board. Where the circuit flexes repeatedly it is built on polyimide film with rolled copper; where the bend happens once during assembly, a stiffer static-flex construction is used instead. Bend radius, neutral-axis placement and copper weight are reviewed against the folding cycle stated in your drawing. Coverlay, stiffeners and shielding are specified alongside the copper, because those three decide how the finished flex behaves inside its housing.
Layer count
1–8 layers
Base film
Polyimide (PI); adhesiveless construction on request
Copper weight
0.5–3 oz (18–105 µm)
Flex thickness
0.06–0.30 mm depending on layer count
Min. trace / space
3/3 mil typical; 4/4 mil recommended for dynamic flex
Min. drill
0.15–0.20 mm
Bend radius
Taken from the material datasheet and confirmed against your folding cycle
Surface treatment
Polyimide coverlay, EMI shielding, stiffeners
Applications
Camera modules, wearables, medical sensors, thin internal harnesses
Rigid-Flex PCB
One part with two behaviours: a rigid-flex board carries the stiffness of a rigid section and the routing freedom of a flex section at the same time. The transition between them — bonded, laser-cut or bookbinder — is where most design problems appear. Bend radii, layer transitions, copper-to-flex termination and the position of components are reviewed before the stack-up is fixed. Where a flex section has to carry a controlled impedance, the flex layers are built to the same rule as the rigid layers and verified on coupon.
Layer count
2–16 layers total, rigid and flex combined
Construction
Bonded rigid-flex; adhesiveless or bookbinder joints on request
Transition
Laser-cut or bookbinder joint, kept clear of component and bend zones
Impedance on flex
Controlled and coupon-tested; 50 Ω / 100 Ω differential as specified
Min. drill
0.15–0.30 mm
Surface treatment
Solder mask on rigid areas, polyimide coverlay on flex areas
Assembly features
SMT pads on rigid areas, through-hole pads at the transition
Applications
Wearables, camera modules, battery-pack management, robotics joints
HDI PCB
HDI is a sequential build rather than a simply thinner board. Each lamination cycle adds wiring density that a conventionally drilled stack cannot reach, and every cycle is another point at which the design can drift. 1+N+1, 2+N+2 and maked-up any-layer structures are built with laser microvias, filled and copper-capped where the drawing calls for it. Core artwork is prepared at the finished line width instead of being scaled afterwards, so fine-pitch land patterns stay manufacturable.
Structure
1+N+1, 2+N+2 and maked-up (any-layer) sequential builds
Layer count
4–20 layers
Laser microvia
0.075–0.20 mm drill with 0.10–0.30 mm pad
Min. trace / space
3/3 mil (0.075 mm) on the core layers
Sequential build
FR-4 core with laser-drilled microvias, filled where specified
Copper filling
Resin-filled microvias with copper capping on request
Finished thickness
0.30–1.60 mm depending on the build
Surface finish
ENIG or immersion gold for fine-pitch and exposed-pad designs
Applications
Fine-pitch BGA, mobile devices, wearables, camera modules, compact IoT
Metal-Core PCB
Swapping the FR-4 core for aluminium or copper is what a metal-core board is for: heat. The core carries heat sideways across the panel instead of letting it collect in one spot, which is what keeps an LED junction or a power switch inside its temperature limit. Core alloy, thickness and the isolation prepreg are selected from the mechanical and electrical requirements in the drawing, including any creepage and clearance distance the isolation layer has to hold. Finish selection matters here as well — carbon ink or matte black is used on LED boards for appearance, while the conductive pads still need a solderable finish.
Core material
Aluminium or copper base, selected from the drawing
Layer count
1–4 layers (core, isolation layer, circuit)
Core thickness
0.5–3.0 mm typical
Isolation
Epoxy or prepreg isolation layer; creepage and clearance set by the drawing
Copper weight
1–4 oz on the circuit layers
Surface finish
ENIG, immersion gold, OSP, HASL lead-free, carbon ink or matte black
Thermal path
Core spreads heat laterally; heat sources are distributed rather than concentrated
Applications
LED lighting and drivers, power modules, solar inverters, charging modules
Heavy Copper PCB
Heavy copper answers a question about current: a conductor that has to carry more than a standard copper layer can. The copper is built up by plating rather than laminated as thick foil, which keeps the layer count low and means the artwork has to be compensated for the extra etch depth. Copper and laminate in the same stack expand at different rates, so the build is reviewed for thermal cycling rather than assumed to survive it. Plating thickness, hole size and minimum trace width all move together on this kind of board.
Layer count
1–8 layers, kept low for build flatness
Finished copper
2–8 oz (70–280 µm) typical; heavier plated weights reviewed per design
Build method
Copper built by plating rather than by thick-foil lamination
Min. trace / space
8/8 mil typical on heavy copper, 5/5 mil on lighter builds
Min. drill
0.30 mm on heavy copper builds
Etching
Artwork compensated for etch depth; wide conductors recommended
Thermal cycling
Stack-up reviewed for expansion match between copper and laminate
Surface finish
HASL lead-free, ENIG, immersion tin, OSP
Applications
EV charging, inverters, power conversion, industrial drives, busbars
PCB Assembly
Assembly is where a board either works or does not, and it is where most of the risk in an order sits. Components are sourced against your approved vendor list, and every substitution is put to you in writing before it is used, because a different part number on the same footprint is not the same part. SMT and through-hole work are combined on the same board where the design needs both, including BGA and QFN packages. Programming, inspection and functional test are part of the build rather than an offer afterwards, and the unit can be boxed, labelled and packed to your instruction.
Assembly type
SMT and through-hole, combined on one board
Package range
01005 through BGA and QFN, leaded and lead-free
Component sourcing
Sourced against your approved vendor list; substitutions flagged in writing before use
Programming
Firmware programming on the line, in-circuit or off-board as required
Inspection
AOI on every board, X-ray for BGA, solderability and appearance checks
Test
Flying probe or fixture, plus functional test against your criteria
Box build
Mechanical assembly, cabling, labelling and packing to your instruction
Material handling
RoHS and REACH compliant handling; moisture-sensitive parts stored by MSL level
What counts as a finished unit
A unit is complete only when the fitted components are the ones you approved, the firmware has been programmed and the functional test has passed. The assembly BOM and the test results are delivered with the shipment instead of staying in the shop.
From Gerber to delivery
Eight checkpoints between your files and your receiving dock. You always know which one the order is at, and what it is waiting for.
DFM review
Your files are checked against the process that will actually run them, and the findings come back as specific points.
Quotation
Itemised pricing by layer count, material, copper weight, surface finish and quantity, so each driver sits on its own line.
Engineering
Stack-up, impedance rules, drill and routing data are prepared and agreed with you before production is released.
Production
Laminate, imaging, etching, drilling, plating, solder mask and surface finish, to the approved specification.
Inspection
AOI and electrical test on every board, plus dimensional checks against the drawing.
Assembly & test
Optional SMT and through-hole assembly, firmware programming and functional test on the same purchase order.
Delivery
Packed with the documentation that describes it, and shipped door to door on EXW, FOB or DDP terms.
Start a conversation
Send us the files, not a vague description
Gerbers, a stack-up, or just the question you are stuck on. We answer inquiries during Monday to Saturday, 9:00–18:30 (GMT+8).